RongpinSamsungA15six-coreExynos5260coreboarddevelopmentboard,manufacturingprocessis28nm;mainfrequency1300MHz~1700MHz;standard2GDDR3memory+16GEMMCstorage,withAndroid4.4.2operatingsystem,hasbeenusedinRongpintwogeneration5260developmentboard.
CLICK TO BUY IMMEDIATELY RP5260C CORE BOARD＞＞
1.CPU BLOCK DIAGRAM
⒉MAIN HARDWARE INDICATORS
| SIZE | 60*55mm |
| HEIGHT | 3mm |
| TECHNOLOGY | 8-Layer Plate, HDI High Strength Half-Hole Process, 8-Layer Third-Order Buried Blind PCB Process Design |
| CPU | Samsung Exynos5260，Based on 2 Cortex-A15 + 4 Cortex-A7，Operating Main Frequency 200MHz~1700MHz |
| GPU | Mali-600 MP |
| MEMORY | 2GB DDR3 Dual-channel 32-bit bus |
| STORAGE | 16GB EMMC4.5（Batch customizable 4/8GB） |
| PMU | Samsung customized original distribution power management chip S2MPA01 |
| WORKING VOLTAGE | 5V（Recommended use of standard 5V/3A power cord） |
| PIN EXPANSION | Lead-out foot up to 184PIN, to meet the user's various practical expansion needs |
| OPERATING TEMPERATURE | Form -25℃ to 75℃ |
| SUPPORT SYSTEM | Android4.4.2 |
（Positive）
⒋PCB DIMENSION MAP
（Positive）
CLICK TO BUY IMMEDIATELY RP5260C CORE BOARD＞＞
1.CPU BLOCK DIAGRAM
⒉MAIN HARDWARE INDICATORS
| SIZE | 60*55mm |
| HEIGHT | 3mm |
| TECHNOLOGY | 8-Layer Plate, HDI High Strength Half-Hole Process, 8-Layer Third-Order Buried Blind PCB Process Design |
| CPU | Samsung Exynos5260，Based on 2 Cortex-A15 + 4 Cortex-A7，Operating Main Frequency 200MHz~1700MHz |
| GPU | Mali-600 MP |
| MEMORY | 2GB DDR3 Dual-channel 32-bit bus |
| STORAGE | 16GB EMMC4.5（Batch customizable 4/8GB） |
| PMU | Samsung customized original distribution power management chip S2MPA01 |
| WORKING VOLTAGE | 5V（Recommended use of standard 5V/3A power cord） |
| PIN EXPANSION | Lead-out foot up to 184PIN, to meet the user's various practical expansion needs |
| OPERATING TEMPERATURE | Form -25℃ to 75℃ |
| SUPPORT SYSTEM | Android4.4.2 |
（Positive）
⒋PCB DIMENSION MAP
（Positive）